By John P. Powers
AN advent TO FIBER OPTICS platforms, 2/e, is appropriate for college students and pros. The subject matter and key aggressive virtue provided by way of the ebook is its pragmatic method of the learn of fiber optics in communications. The textual content integrates varied parts of fiber optics and offers a transparent photo of ways they're utilized in fiber optics communique. by way of introducing the terminology utilized in fiber optics, and describing the construction blocks of an optical fiber procedure, Powers' textual content allows scholars to method the preliminary layout of optical hyperlinks, and to appreciate the tradeoffs made in designing and utilizing a fiber optics communique line.
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Extra info for An Introduction to Fiber Optic Systems
Figure 12. Thin film data-acquisition hybrid. ) 26 Hybrid Microcircuit Technology Handbook A unique item that was incorporated in the load-controller hybrids was an internal fuse. The hybrid used three parallel I-mil-diameter gold wires in series with the incoming power. The internal "fuse" protected spacecraft wiring and further decreased its overall weight. Figure 13 is a photograph of one ofthe power hybrids. Note that it was partitioned in two sections, a low power and a high power section.
38 Hybrid Microcircuit Technology Handbook Flgu~ 5. SEM phO(o of 96% alumina used for thick-film circuits. 1 Grades of Alumina Manufacturers ofalumina substrates offer several grades ranging from those having relatively rough surfaces, used for thick-film circuits, to those with extremely smooth, lapped and polished surfaces (I microinch or less CLA finish), used for the ultimate in high resolution, precision, thin-film circuits. Substrates with intennediate smoothness (4-6 microinch eLA) are available for more typical thin film hybrid applications.
Wire-bonded IC chips occupy only one-fourth the volume ofdual in-line IC packages used in printed circuit assemblies. Screen-printed or vacuum-deposited resistors replace pre-packaged chip resistors and avoid solder interconnections, effecting still further reductions in space and weight. Introduction Figure 6. Small hybrid microcircuit in TO package. ) Figure 7. ) 15 ~ 0\ ~ ~ ~ ~ n· ~ n ~. l:: :::.. ~ ~ ::: ~ ~ ~ ~ ::: §: ~ ~ Figure 8. High density thick-film hybrid using tiered bonding to accommodate over 1,700 wire bonds.
An Introduction to Fiber Optic Systems by John P. Powers